Comparison of the curing kinetic behavior for two epoxy resin systems containing EPIKOTE 828-EPIKURE 3090 and DURATEK KLM 606a-DURATEK KLM 606b

Abstract

The aim of the study is to determine the optimum cure temperatures and kinetics for two different epoxy resin systems without using solvent. Two resin systems consist of EPIKOTE 828® epoxy resin-EPIKURE® 3090 polyamidoamine curing agent and DURATEK® KLM 606A epoxy resin-DURATEK®KLM 606B polyamide curing agent. The ratio of resin to curing agent was kept as 1:1 for both the systems. Curing temperatures of both the systems were determined and kinetic parameters were calculated with respect to the experimental results following nth-order kinetics. Then, a series of isothermal temperatures was applied to the resin systems in order to assess the cure process in terms of conversion, time, and temperature by using differential scanning calorimeter (DSC). The test results of both systems show that the rate of degree of cure for EPIKOTE 828® epoxy resin-EPIKURE® 3090 polyamidoamine curing agent system is approximately 10 times higher than that of DURATEK® KLM 606A epoxy resin-DURATEK® KLM 606B polyamide curing agent system at 230°C. © 2007 Society of Plastics Engineers.