Stress analysis of functionally graded disc under thermal and mechanical loads

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dc.contributor.authorKurşun, Ali
dc.contributor.authorTopçu, Muzaffer
dc.contributor.authorTetik, Tuğba
dc.date.accessioned2019-05-13T09:07:16Z
dc.date.available2019-05-13T09:07:16Z
dc.date.issued2011
dc.departmentHitit Üniversitesi, Mühendislik Fakültesi, Makine Mühendisliği Bölümü
dc.description.abstractIn this study, the elastic stress analysis of annular discs made of functionally graded materials (FGMs) subjected to both uniform pressures on the inner surface and a linearly decreasing temperature distribution has been carried out. The elasticity modulus and thermal expansion coefficient of the discs are assumed to vary radially according to power law functions and Poisson's ratio is kept constant. Analytical solutions for the elastic stress in annular discs are obtained under plane stress assumption. Calculation programs were prepared by authors using MATLAB 7.1. The change of the stresses, displacements, elasticity modulus and thermal expansion coefficient according to the gradient parameters were investigated and presented. © 2011 Published by Elsevier Ltd.
dc.identifier.citationKurşun, A., Topçu, M., Tetik, T. (2011). Stress analysis of functionally graded disc under thermal and mechanical loads. Procedia Engineering, 10, 2949-2954.
dc.identifier.doi10.1016/j.proeng.2011.04.489
dc.identifier.endpage2954en_US
dc.identifier.issn1877-7058
dc.identifier.scopusqualityN/A
dc.identifier.startpage2949en_US
dc.identifier.urihttps://doi.org/10.1016/j.proeng.2011.04.489
dc.identifier.urihttps://hdl.handle.net/11491/1766
dc.identifier.volume10en_US
dc.identifier.wosqualityN/A
dc.indekslendigikaynakWeb of Science
dc.indekslendigikaynakScopus
dc.language.isoen
dc.publisherElsevier Ltd
dc.relation.ispartofProcedia Engineering
dc.relation.publicationcategoryKonferans Öğesi - Uluslararası - Kurum Öğretim Elemanı
dc.rightsAttribution-NonCommercial-NoDerivs 3.0 Unported (CC BY-NC-ND 3.0)*
dc.rightsinfo:eu-repo/semantics/openAccess
dc.rights.urihttps://creativecommons.org/licenses/by-nc-nd/3.0/*
dc.subjectDiscen_US
dc.subjectFunctionally Graded Materialsen_US
dc.subjectThermal Loaden_US
dc.subjectThermal Stressen_US
dc.titleStress analysis of functionally graded disc under thermal and mechanical loads
dc.typeConference Object

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